Compact Ultra-High Precision Etching Device MPE40
Compact Ultra-High Precision Etching Device MPE40
【Process】 Input → Etching → Liquid Drain → Acid Wash → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs
- Company:二宮システム
- Price:5 million yen-10 million yen